DynamicTMN® Java CMIP eBonding/TA SDK

Java CMIP EBTA and MLT Toolkit

The DynamicTMN® CMIP eBonding/TA SDK provides specialized Java APIs and tools for use in the development of telecommunications Electronic Bonding Gateway applications for Trouble Administration (EBTA) and Mechanized Loop Test (MLT).

Building upon our industry proven DynamicTMN® CMIP SDKs, Monfox has developed add-on API modules which provide everything you need to rapidly implement platform-independent manager and agent Trouble Administration (TA) and Mechanized Loop Test (MLT) eBonding gateways using Java and XML/Web Services technologies.

The CMIP eBonding/TA SDK is typically used to integrate an existing in-house trouble ticketing system (such as Remedy, Clarify, legacy, etc) with a trading partner's trouble administration system through the partner's existing CMIP eBonding agent gateway. This results in:

• automated trouble report generation to the LEC
• elimination of time-consuming phone based ticket entry
• elimination of error-prone manual dual-ticket management
• automatic updates of ticket status from the LEC
• significant reduction in overall trouble resolution times

The toolkit is also often used to replace existing CMIP eBonding gateways for a significant reduction in recurring maintenance and usage costs as well as increased flexibility. Some of the benefits of implementing your eBonding gateway with Monfox are:

• 100% Java APIs, tools and applications
• hardware platform independence (Intel, Sun, HP, IBM, Apple)
• OS independence (Linux, Solaris, HPUX, AIX, Windows, MacOS X)
• easily integrated with existing trouble ticket systems
• no additional cost for switching hardware/OS platforms
• very short development cycle (weeks rather than months, we can help)
• low cost of development (probably less than your current maintenance costs)
• low cost of maintenance
• the BEST customer support in the industry
• no per-ticket or per-transaction fees

In addition to the deployments listed above, the CMIP eBonding/TA SDK can also be used to implement a new in-house eBonding Agent Gateway which allows your trading partners to enter trouble reports into your in-house trouble ticketing system. This deployment has all of the benefits listed above in addition to allowing your trading partner use their existing eBonding manager gateway (if they already have one) thus saving costs for both parties.

Download DynamicTMN® CMIP eBonding/TA Suite Evaluation

Built upon our industry proven DynamicTMN® CMIP Manager & Agent SDKs, the CMIP eBonding/TA SDK provides support for the following features:

• Supports the ANSI T1.TR-40 Electronic Bonding Security
  
  - extends the RFC1006 stack to add TR-40 security support
  - supports both agent and manager eBonding applications
  - provides support for multiple remote eBonding entities
  - configured via XML config files or high level stack API
  - see the DynamicTMN® eBonding Stack
  
  
• Supports the ANSI EBTA and MLT Information Model
  
  - uses the GDMO/ASN.1 metadata generator
  - includes ANSI T1.227/228/262 and dependencies (X.721, etc).
  - may be used in both agent and manager eBonding applications
  
  
• Includes an ANSI T1.278-200X EBTA XML/CMIP Translation API
  
  - uses EBTA information model
  - T1.278 tML-TABase XML values to/from T1.227 attribute values
  - T1.278 tML-TA XML messages to/from CMIS messages
  - may be used to implement CMIP to XML agent and manager gateways
  
  
• Includes an ANSI T1.277-200X MLT XML/CMIP Translation API
  
  - uses Service Test Function/Mechanized Loop Test information model
  - T1.277 tML-ServiceTestBase XML values to/from T1.262 data value
  - T1.277 tML-ServiceTest XML messages to/from CMIS messages
  - may be used to implement CMIP to XML agent and manager gateways
  
  
• Includes a High-level eBonding XML/CMIS Manager Gateway API
  
  - encapsulates all CMIS and ASN.1 operations
  - you only work with the tML defined XML messages
  - generic API handles ALL EBTA and MLT interactions
  - eliminates need to learn GDMO/CMIS and ASN.1
  - you only implement the XML transport (SOAP/JMS/etc)
  
  
• Includes a High-level eBonding XML/CMIS Agent Gateway API
  
  - encapsulates all CMIS and ASN.1 operations
  - performs necessary agent role CMIS message validation
  - you only work with the tML defined XML messages
  - generic API handles ALL EBTA and MLT interactions
  - eliminates need to learn GDMO/CMIS and ASN.1
  - you only need to implement the XML transport (SOAP/JMS/etc)
  
  
• Use with the CMIP eBonding/TA Agent Simulator (details)
  
  - simulates ILEC agent gateway behavior
  - supports all trouble report related EBTA functions
  - supports MLT simulation
  - simplifies ILEC certification testing
  - see: CMIP eBonding/TA Agent Simulator

The CMIP eBonding/TA SDK package includes the following high-level APIs:

• eBonding/TA XML Manager Gateway API
• eBonding/TA XML Agent Gateway API
• eBonding/TA XML Translator API
• GDMO Manager API
• GDMO Agent API
• CMIS Messaging API
• ASN.1 API
• ASN.1 and GDMO Metadata API

As well as the following protocol adaptor:

• DynamicTMN® eBonding Stack

We also highly recommend the following additional tool(s) for use with the SDK during product development and verification:

• CMIP eBonding/TA Agent Simulator

As illustrated by the highlighted components the following diagram (click for details):

(Note 1: greyed-out components are not included)
(Note 2: additional components may be purchased separately.)

See the CMIP eBonding/TA SDK specifications below:

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Java Platform Requirements:

• Java 2: [ JDK 1.2/1.3 + JCE1.2.2] or [J2SDK 1.4 or newer]

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Operating System Requirements:

Any operating system which supports the Java versions listed in the Java Platform Requirements section above. Some of the operating systems commonly used with the DynamicTMN® products are:

• Microsoft Windows (95,98,XP,NT,2000)
  
• Linux (Redhat, etc)
  
• Hewlett Packard HP-UX
  
• Sun Solaris (SPARC & x86)
  
• IBM AIX
  
• Apple MacOS X
  

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Hardware Requirements:

Minimum Hardware

• Physical memory (RAM): 256MB
• Disk space: 50MB (distribution package size)

Recommended Hardware

• Physical memory (RAM): 512MB or greater
• Disk space: 100MB (distribution,log,data files)

NOTE: the amount of memory and disk space will vary depending upon the details of your specific application. Please email monfox support to get the recommended requirements for your specific deployment.

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Protocol Stack Support:

The CMIP eBonding/TA SDK includes the following protocol stacks:

Stack   Description   Details   Package  RFC1006 CMIP/OSI over TCP/IP view details included ROSE/TCPIP CMIP/ROSE over TCP/IP view details included LOCAL JVM Optimized Intra-JVM Stack view details included eBonding ANSI.TR-40 + RFC1006 view details included OSI/X.25 CMIP over OSI/X.25 view details add-on

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Deployment Configurations:

Software developed with the CMIP eBonding/TA SDK may be deployed as a:

• standalone Java application
• integrated module in a larger Java application
• web-application (using XML,SOAP,JSP, servlets, etc)
• EJB(s) in an application-server
• Java application plug-in
• legacy application plug-in through JNI

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Product Evaluation:

For a complete set of API examples, API Javadoc, developer guides, agent simulators, and much more, please download the DynamicTMN® CMIP eBonding/TA SDK evaluation package.

Download DynamicTMN® CMIP eBonding/TA Suite Evaluation

The CMIP eBonding/TA SDK supports the following core standards in addition to the eBonding specific standards listed in the next section:

• Java 2: Java 2 SDK version 1.2 or greater
• TMF 040: Based on the TMForum ASN.1 API Standard
• TMF 041: Based on the TMForum CMIS API Standard
• TMF 042: Based on the TMForum GDMO API Standard
• ITU-T X.208/X.680: Abstract Syntax Notation One (ASN.1)
• ITU-T X.209/X.690: ASN.1 Basic Encoding Rules (BER)
• ITU-T X.219: Remote Operations (ROSE) Service Definition
• ITU-T X.229: Remote Operations (ROSE) Protocol
• ITU-T X.701: Systems Management Overview
• ITU-T X.710: Common Management Information Service (CMIS)
• ITU-T X.711: Common Management Information Protocol (CMIP)
• ITU-T X.720: Structure of Management Information (SMI)
• ITU-T X.721: Definition of Management Information (DMI)
• ITU-T X.722: Guidelines for the Definition of Managed Objects (GDMO)
• ITU-T X.723: Generic Management Function
• ITU-T X.725: General Relationship Model
• ITU-T X.730: Object Management Function
• ITU-T X.731: State Management Function
• ITU-T X.732: Attributes for Representing Relationships
• ITU-T X.733: Alarm Reporting Function
• ITU-T X.734: Event Report Management Function
• RFC1006: OSI over TCPIP (CMIP/OSI over TCP/IP)

The CMIP eBonding/TA SDK provides support for the following Electronic Bonding related standards:

• ANSI T1.227: Trouble Administration Information Data Model
• ANSI T1.228: Trouble Administration Service Interface
• ANSI T1.262: Mechanized Loop Test/Service Test Function
• ANSI T1.278-200X: Trouble Administration XML Schema (tML-TA)
• ANSI T1.277-200X: Service Test XML Schema (tML-ServiceTest)
• ANSI T1.TR-40: Electronic Bonding Security
• CMIP/RFC1006: CMIP/OSI over TCP
  
  
• and all additional standards required by the above.

Following is a list of some other products often used in addition to the CMIP eBonding/TA SDK:

• CMIP eBonding/TA Agent Simulator

as well as some other related Monfox products which may be of interest to you:

• CMIP Manager SDK
• CMIP Agent SDK
• CMIP Web Services/XML SDK
• CMIP NPAC/LNP SDK

Download DynamicTMN® CMIP eBonding/TA Suite Evaluation